CERAMICS CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a ceramics circuit board with high reliability. SOLUTION: In this ceramics circuit board, an Al plate is bonded to at least one main surface of a ceramics board. Purity of the Al plate is at least 99.0 wt.% and at most 99.95 wt.%. The ceramics board is made of LlN. T...

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Bibliographische Detailangaben
Hauptverfasser:	SUGIMOTO ISAO, OGATA YOICHI, NONOGAKI RYOZO, UTO MANABU, IBUKIYAMA MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a ceramics circuit board with high reliability. SOLUTION: In this ceramics circuit board, an Al plate is bonded to at least one main surface of a ceramics board. Purity of the Al plate is at least 99.0 wt.% and at most 99.95 wt.%. The ceramics board is made of LlN. The Al plate is bonded to the ceramics board via moreover an Al alloy, wherein Mg and further at least one among Si, Ge and Cu are contained and the temperature generating liquid phase is 500-630 deg.C.