SILICONE-MODIFIED EPOXY RESIN, ITS PRODUCTION AND SILICONE- MODIFIED EPOXY RESIN COMPOSITION

PROBLEM TO BE SOLVED: To obtain a silicone-modified epoxy resin using bisphenol-A or bisphenol-F as a base, having a high heat resistance and useful as a coating capable of being applied to a heating tool such as an oven. SOLUTION: This silicone-modified epoxy resin of formula I (Ep expresses Me or...

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Bibliographische Detailangaben
Hauptverfasser:	DEUKU SUN BAE, CHON SUU PAAKU, JIN SEON YU
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a silicone-modified epoxy resin using bisphenol-A or bisphenol-F as a base, having a high heat resistance and useful as a coating capable of being applied to a heating tool such as an oven. SOLUTION: This silicone-modified epoxy resin of formula I (Ep expresses Me or a group of formula II) is obtained by heating and melting an epoxy resin based on general bisphenol-A or bisphenol-F at 50-150 deg.C, adding 5-50 wt.% methoxy group silicone intermediate based on the total weight of the reacting material and heating at 150-200 deg.C. It is preferable that the density of the methoxy group silicone intermediate is 1,120-1,140, its viscosity is 50-100 cp (at 25 deg.C), and methoxy content is 14.0 to 16.0.