DOUBLE-FACED POLISHING DEVICE AND SYSTEM FOR IT

PROBLEM TO BE SOLVED: To provide a double-faced polishing device assuring an enhanced mass-producibility and polishing accuracy and capable of preventing eccentric wear of a lower and an upper surface plate. SOLUTION: The arrangement according to the present invention includes a lower 1 and an upper...

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Bibliographische Detailangaben
1. Verfasser:	ARAI HATSUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a double-faced polishing device assuring an enhanced mass-producibility and polishing accuracy and capable of preventing eccentric wear of a lower and an upper surface plate. SOLUTION: The arrangement according to the present invention includes a lower 1 and an upper surface plate 2, a carrier 3, and a first carrier swinging mechanism 4. The lower 1 and the upper surface plate 2 are composed of lower surface plate segments 10 and 11 and upper surface plate segments 20 and 21, respectively, arranged rotatable independently, while the carrier 3 is composed of a carrier body 30 having ten work holding holes 31 positioned at the periphery and five work holding holes positioned at the inside surface and a carrier holding frame 37 to hold the body 30. The first carrier swinging mechanism 4 has crank mechanisms 4-1 and 4-2 and swings the carrier body 30 in the shape of '8' upon holding the carrier holding frame 37.