SEMICONDUCTOR DEVICE AND MOUNTING METHOD THEREFOR

PROBLEM TO BE SOLVED: To improve handling performance of a semiconductor device during mounting on a mounting board as well as its heat radiation, by forming a cover member so as to make it releasable from a ring member, without impairing attaching of the ring member to a package substrate. SOLUTION...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MATSUSHIMA HIROTSUGU, TOMITA YOSHIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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