SEMICONDUCTOR DEVICE AND MOUNTING METHOD THEREFOR

PROBLEM TO BE SOLVED: To improve handling performance of a semiconductor device during mounting on a mounting board as well as its heat radiation, by forming a cover member so as to make it releasable from a ring member, without impairing attaching of the ring member to a package substrate. SOLUTION: A semiconductor chip 5 is mounted on a package substrate 6 and sealed with a sealing material. Next, a ring 2 is fixed to the substrate 6 with an adhesive 4. Furthermore, a cover 1 is attached onto the ring 2 with an adhesive 3, whereby a cavity structure for protecting the chip 5 is formed. Then, external electrodes 6b are attached to the lower surface of the substrate 6, whereby a semiconductor device 10 is formed. As a result, before being mounted onto a mounting board 7, the device 10 has such a satisfactory handling performance without giving damages to the chip 5. Also, after being mounted onto the board 7, the device 10 allows a radiating fin 8 to be attached directly to the chip 5 by removing the cover 1, whereby its heat radiation is improved.