EPOXY GROUP-CONTAINING SILICONE RESIN

PROBLEM TO BE SOLVED: To obtain the subject resin capable of providing a cured product excellent in crack resistance and adhesion while maintaining heat resistance, electrical and optical characteristics, etc., and useful for applications such as an adhesive for semiconductor elements by carrying out a condensation polymerization of a specific organopolysiloxane and a specified disiloxane compound. SOLUTION: This epoxy group-containing silicone resin is obtained by carrying out a condensation polymerization of (A) a silanol group-containing organopolysiloxane represented by the average compositional formula (HO) aR1SiO(3-a)/2 [R1 is methyl, ethyl, propyl, vinyl or phenyl; (a) is 0.02-2] and having 130-5,000 molecular weight and (B) an epoxy group-containing disiloxane compound represented by formula I (R2 is represented by formula II or III; R3 is methyl or ethyl) The resin is preferably produced by mixing the two components so as to provide (1/1) to (1/2) (molar ratio) of (OH groups in the component A)/(OR3 groups in the component B), heating the resultant mixture in the presence of a condensing catalyst in an organic solvent and conducting the condensation polymerization reaction.