METHOD FOR TREATING METAL SURFACE

PROBLEM TO BE SOLVED: To provide a method for treating a metal surface capable of easily and accurately surface treating a mold such as a mold for molding a printless photoconducting plate, a mold for molding a plastic lens or the like. SOLUTION: The method for treating a metal surface comprises the...

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Bibliographische Detailangaben
Hauptverfasser: TOGO TORU, IWASAKI HIROO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for treating a metal surface capable of easily and accurately surface treating a mold such as a mold for molding a printless photoconducting plate, a mold for molding a plastic lens or the like. SOLUTION: The method for treating a metal surface comprises the steps of forming a copper-plating layer 2 having a thickness of 50 to 2,000 μm on the surface, subjecting the layer 2 to predetermined machining, and forming a predetermined metal-plated layer 4 such as a nickel-plated layer, a chromium- plated layer or the like on the surface 21 of the cut layer 2.