MOLDED SMD COMPONENT AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To prevent the generation of a void if a plurality of products are coupled with each other using a grouping board and these products are molded and also to reduce a warpage of the board, and to contrive the enhancement of the yield of the manufacture of a molded SMD component a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OZAKI YUMIKO, AKACHI YOSHIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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