MOLDED SMD COMPONENT AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To prevent the generation of a void if a plurality of products are coupled with each other using a grouping board and these products are molded and also to reduce a warpage of the board, and to contrive the enhancement of the yield of the manufacture of a molded SMD component and a modification of the workability at the manufacture of the SMD component. SOLUTION: Circuit components 12 are respectively mounted in every section 11 of the component mounting surface on one side of a grouping board 10 formed by mixing ferrite powder with a resin, and the component mounting surface on the one side of the above board 10 is molded with a composite ferrite 20 formed by mixing ferrite powder with a resin to cover the whole circuit component in each section 11. The number of the sections arranged in a second direction Q on the board 10 is made more than the number of the sections arranged in a first direction P on the board 10 and in the thickness of the coupling parts between the adjacent sections of the ferrite 20, the thickness of the second coupling parts 22b in the directions linking the sections 11 arranged in the above second direction Q is formed thinner than the thickness of the first coupling parts 22a in the directions linking the sections 11 arranged in the above first direction P.