PRINTED WIRING BOARD AND MANUFACTURE THEREOF

PRINTED WIRING BOARD AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To provide a printed wiring board and its manufacturing method which use a build-up method, by which the working stability of a via hole of small diameter (for example, 50 μm) and high reliability of via hole connection can be realized and a high adhesion strength between a res...

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Hauptverfasser: KOMATSU KENJI, YAGASAKI AKIRA
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Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator KOMATSU KENJI
YAGASAKI AKIRA
description PROBLEM TO BE SOLVED: To provide a printed wiring board and its manufacturing method which use a build-up method, by which the working stability of a via hole of small diameter (for example, 50 μm) and high reliability of via hole connection can be realized and a high adhesion strength between a resin in a build layer and a conductor can be obtained. SOLUTION: A copper foil with resin is used to a build layer, so that high adhesion strength against peeling is produced between a resin 3 in the build layer and a conductor 4. In addition, the copper foil in a via hole is removed by a diameter larger than that of the via hole, and a laser with a beam diameter focused in matching with the via hole diameter is irradiated to make a hole in the resin, thereby resulting in the working stability of a via hole of small diameter (e.g. 50 μm) and high reliability of plating connection of the via hole.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2001024329A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2001024329A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2001024329A3</originalsourceid><addsrcrecordid>eNrjZNAJCPL0C3F1UQj3BDLcFZz8HYNcFBz9XBR8Hf1C3RydQ0KDXBVCPFyDXP3deBhY0xJzilN5oTQ3g5Kba4izh25qQX58anFBYnJqXmpJvFeAkYGBoYGRibGRpaMxUYoA2P4lfg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PRINTED WIRING BOARD AND MANUFACTURE THEREOF</title><source>esp@cenet</source><creator>KOMATSU KENJI ; YAGASAKI AKIRA</creator><creatorcontrib>KOMATSU KENJI ; YAGASAKI AKIRA</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a printed wiring board and its manufacturing method which use a build-up method, by which the working stability of a via hole of small diameter (for example, 50 μm) and high reliability of via hole connection can be realized and a high adhesion strength between a resin in a build layer and a conductor can be obtained. SOLUTION: A copper foil with resin is used to a build layer, so that high adhesion strength against peeling is produced between a resin 3 in the build layer and a conductor 4. In addition, the copper foil in a via hole is removed by a diameter larger than that of the via hole, and a laser with a beam diameter focused in matching with the via hole diameter is irradiated to make a hole in the resin, thereby resulting in the working stability of a via hole of small diameter (e.g. 50 μm) and high reliability of plating connection of the via hole.</description><edition>7</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2001</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20010126&amp;DB=EPODOC&amp;CC=JP&amp;NR=2001024329A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20010126&amp;DB=EPODOC&amp;CC=JP&amp;NR=2001024329A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOMATSU KENJI</creatorcontrib><creatorcontrib>YAGASAKI AKIRA</creatorcontrib><title>PRINTED WIRING BOARD AND MANUFACTURE THEREOF</title><description>PROBLEM TO BE SOLVED: To provide a printed wiring board and its manufacturing method which use a build-up method, by which the working stability of a via hole of small diameter (for example, 50 μm) and high reliability of via hole connection can be realized and a high adhesion strength between a resin in a build layer and a conductor can be obtained. SOLUTION: A copper foil with resin is used to a build layer, so that high adhesion strength against peeling is produced between a resin 3 in the build layer and a conductor 4. In addition, the copper foil in a via hole is removed by a diameter larger than that of the via hole, and a laser with a beam diameter focused in matching with the via hole diameter is irradiated to make a hole in the resin, thereby resulting in the working stability of a via hole of small diameter (e.g. 50 μm) and high reliability of plating connection of the via hole.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2001</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAJCPL0C3F1UQj3BDLcFZz8HYNcFBz9XBR8Hf1C3RydQ0KDXBVCPFyDXP3deBhY0xJzilN5oTQ3g5Kba4izh25qQX58anFBYnJqXmpJvFeAkYGBoYGRibGRpaMxUYoA2P4lfg</recordid><startdate>20010126</startdate><enddate>20010126</enddate><creator>KOMATSU KENJI</creator><creator>YAGASAKI AKIRA</creator><scope>EVB</scope></search><sort><creationdate>20010126</creationdate><title>PRINTED WIRING BOARD AND MANUFACTURE THEREOF</title><author>KOMATSU KENJI ; YAGASAKI AKIRA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2001024329A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2001</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>KOMATSU KENJI</creatorcontrib><creatorcontrib>YAGASAKI AKIRA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KOMATSU KENJI</au><au>YAGASAKI AKIRA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PRINTED WIRING BOARD AND MANUFACTURE THEREOF</title><date>2001-01-26</date><risdate>2001</risdate><abstract>PROBLEM TO BE SOLVED: To provide a printed wiring board and its manufacturing method which use a build-up method, by which the working stability of a via hole of small diameter (for example, 50 μm) and high reliability of via hole connection can be realized and a high adhesion strength between a resin in a build layer and a conductor can be obtained. SOLUTION: A copper foil with resin is used to a build layer, so that high adhesion strength against peeling is produced between a resin 3 in the build layer and a conductor 4. In addition, the copper foil in a via hole is removed by a diameter larger than that of the via hole, and a laser with a beam diameter focused in matching with the via hole diameter is irradiated to make a hole in the resin, thereby resulting in the working stability of a via hole of small diameter (e.g. 50 μm) and high reliability of plating connection of the via hole.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title PRINTED WIRING BOARD AND MANUFACTURE THEREOF
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T02%3A37%3A46IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KOMATSU%20KENJI&rft.date=2001-01-26&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2001024329A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true