PRINTED WIRING BOARD AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To provide a printed wiring board and its manufacturing method which use a build-up method, by which the working stability of a via hole of small diameter (for example, 50 μm) and high reliability of via hole connection can be realized and a high adhesion strength between a res...

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Bibliographische Detailangaben
Hauptverfasser:	KOMATSU KENJI, YAGASAKI AKIRA
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a printed wiring board and its manufacturing method which use a build-up method, by which the working stability of a via hole of small diameter (for example, 50 μm) and high reliability of via hole connection can be realized and a high adhesion strength between a resin in a build layer and a conductor can be obtained. SOLUTION: A copper foil with resin is used to a build layer, so that high adhesion strength against peeling is produced between a resin 3 in the build layer and a conductor 4. In addition, the copper foil in a via hole is removed by a diameter larger than that of the via hole, and a laser with a beam diameter focused in matching with the via hole diameter is irradiated to make a hole in the resin, thereby resulting in the working stability of a via hole of small diameter (e.g. 50 μm) and high reliability of plating connection of the via hole.