SEMICONDUCTOR INSPECTING APPARATUS

PROBLEM TO BE SOLVED: To provide a semiconductor inspecting apparatus capable of applying many electrical signals to a semiconductor device. SOLUTION: This apparatus comprises a voltage feeder A1 for applying a plurality of electric signals to a semiconductor substrate under test, a stage 12 facing...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HIGUCHI HIROHISA, OGURI SHIGEHISA, KANEDA KOJI, TERADA HIROTOSHI, KOJIMA SHINICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a semiconductor inspecting apparatus capable of applying many electrical signals to a semiconductor device. SOLUTION: This apparatus comprises a voltage feeder A1 for applying a plurality of electric signals to a semiconductor substrate under test, a stage 12 facing the bottom of the voltage feeder, including supports 11 for supporting a semiconductor substrate supporting surface, an imaging unit A2 disposed at the opposite side of the voltage feeder to the stage 12 for picking up image of the substrate via the supports, and an infrared irradiating unit 23 disposed at the opposite side of the voltage feeder A1 to the stage 12 for irradiating the semiconductor substrate via the supports 11 and the imaging unit A2 is of inverted type.