CHUCKING TYPE RECEPTACLE

PROBLEM TO BE SOLVED: To enhance the reliability of contact between a wiring circuit board and electrode pads in a chucking type receptacle and to secure firm contact between the receptacle and the electrode pad by appropriately removing glass dust on the electrode pad in the board. SOLUTION: This h...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KOBORI EIJI, NISHIKIDO TAKUMI, FUJISHITA TOSHIHIRO, SHIRAGAMI MOTOHISA, SASAKI TOMIO
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To enhance the reliability of contact between a wiring circuit board and electrode pads in a chucking type receptacle and to secure firm contact between the receptacle and the electrode pad by appropriately removing glass dust on the electrode pad in the board. SOLUTION: This hold-contact type receptacle comprises: first and second upper clamping pieces 4, 5 to be brought into press-contact with the upper portions of first and second electrode pads 2, 3 disposed opposite to both ends while holding the ends of a wiring circuit board 1; and first and second lower clamping pieces 6, 7 to be brought into press-contact with the lower portions of the first and second electrode pads 2, 3 immediately under the first and second upper clamping pieces 4, 5, wherein a first contact 8 is constituted of the first upper clamping piece 4 and the first lower clamping piece 6 while a second contact 9 is constituted of the second upper clamping piece 5 and the second lower clamping piece 7. Consequently, the end of the board 1 is held between the first and second upper clamping pieces 4, 5, and then, between the first and second lower clamping pieces 6, 7.