SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To hold a loop of a wire and prevent reduction in breakdown voltage and short-circuiting even if vibration and an impact are applied on a lead frame prior to external coating of a resin by a method wherein an inclined plane is formed in one end of a lead. SOLUTION: In this structure, a semiconductor pellet 1 is mounted on an island 4 of a lead frame, and an electrode on the semiconductor pellet 1 is electrically connected to a lead 6 one end of which is disposed in the vicinity of the island 4 via a wire 8. In this case, an inclined plane 6a approaches toward the semiconductor pellet 1 and elevates, and is formed at one end of the lead 6, and also the vicinity of a connection part on a lead 6 side of the wire 8 is brought into contact with the inclined plane 6a.