METHOD AND APPARATUS FOR POSITIONING AND BALL MOUNT INSPECTION

PROBLEM TO BE SOLVED: To eliminate the uselessness of providing optical units individually by an arrangement wherein an optical system recognizing means moves relatively to a work stage to pick up the image of a work and performs both positioning of the work and ball mount inspection after mounting. SOLUTION: A wafer is provided on a wafer stage 30 at a wafer positioning position 8 and positioning data is obtained from the attitude of the wafer where the image of an alignment mark on the surface of the wafer is picked up by means of CCD cameras 23, 23'. Subsequently, the wafer stage 30 moves to a flux transfer position 11 and stops thereat, the CCD cameras 23, 23' pick up the image of a transfer head and then the transfer head is aligned with the wafer while taking account of wafer position data. The wafer stage 30 moves to a mount position 20 after transfer and the CCD cameras 23, 23' position the mount head before solder balls are mounted on the wafer. Subsequently, the wafer stage 30 returns back to the wafer positioning position 8 and the CCD cameras 23, 23' inspect the mounting state of the solder balls on the wafer.