SUBSTRATE WASHING APPARATUS
PROBLEM TO BE SOLVED: To well wash the end surfaces of the peripheral edge part of a substrate in a substrate washing apparatus for the scrub-washing of the substrate. SOLUTION: A wafer W held and rotated by end surface support hands 100, 101 is washed while scrubbed with the scrubbing members 105,...
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| creator | OKAMOTO TADAO TSUJIKAWA HIROTAKA |
| description | PROBLEM TO BE SOLVED: To well wash the end surfaces of the peripheral edge part of a substrate in a substrate washing apparatus for the scrub-washing of the substrate. SOLUTION: A wafer W held and rotated by end surface support hands 100, 101 is washed while scrubbed with the scrubbing members 105, 109 of the scrubbing units 106, 110 rotated by a rotary drive source not shown in a drawing. Stepped parts D1, D2 capable of coming into contact with the end surfaces of the wafer W are formed to a part of the contact surfaces S1, S2 of the scrubbing members 105, 109. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2001009386A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2001009386A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2001009386A3</originalsourceid><addsrcrecordid>eNrjZJAODnUKDglyDHFVCHcM9vD0c1dwDAhwBAqEBvMwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknivACMDA0MDA0tjCzNHY6IUAQCqhSEv</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SUBSTRATE WASHING APPARATUS</title><source>esp@cenet</source><creator>OKAMOTO TADAO ; TSUJIKAWA HIROTAKA</creator><creatorcontrib>OKAMOTO TADAO ; TSUJIKAWA HIROTAKA</creatorcontrib><description>PROBLEM TO BE SOLVED: To well wash the end surfaces of the peripheral edge part of a substrate in a substrate washing apparatus for the scrub-washing of the substrate. SOLUTION: A wafer W held and rotated by end surface support hands 100, 101 is washed while scrubbed with the scrubbing members 105, 109 of the scrubbing units 106, 110 rotated by a rotary drive source not shown in a drawing. Stepped parts D1, D2 capable of coming into contact with the end surfaces of the wafer W are formed to a part of the contact surfaces S1, S2 of the scrubbing members 105, 109.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLEANING ; CLEANING IN GENERAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; PREVENTION OF FOULING IN GENERAL ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2001</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010116&DB=EPODOC&CC=JP&NR=2001009386A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010116&DB=EPODOC&CC=JP&NR=2001009386A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OKAMOTO TADAO</creatorcontrib><creatorcontrib>TSUJIKAWA HIROTAKA</creatorcontrib><title>SUBSTRATE WASHING APPARATUS</title><description>PROBLEM TO BE SOLVED: To well wash the end surfaces of the peripheral edge part of a substrate in a substrate washing apparatus for the scrub-washing of the substrate. SOLUTION: A wafer W held and rotated by end surface support hands 100, 101 is washed while scrubbed with the scrubbing members 105, 109 of the scrubbing units 106, 110 rotated by a rotary drive source not shown in a drawing. Stepped parts D1, D2 capable of coming into contact with the end surfaces of the wafer W are formed to a part of the contact surfaces S1, S2 of the scrubbing members 105, 109.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLEANING</subject><subject>CLEANING IN GENERAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>PREVENTION OF FOULING IN GENERAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2001</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAODnUKDglyDHFVCHcM9vD0c1dwDAhwBAqEBvMwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknivACMDA0MDA0tjCzNHY6IUAQCqhSEv</recordid><startdate>20010116</startdate><enddate>20010116</enddate><creator>OKAMOTO TADAO</creator><creator>TSUJIKAWA HIROTAKA</creator><scope>EVB</scope></search><sort><creationdate>20010116</creationdate><title>SUBSTRATE WASHING APPARATUS</title><author>OKAMOTO TADAO ; TSUJIKAWA HIROTAKA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2001009386A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2001</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLEANING</topic><topic>CLEANING IN GENERAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>PREVENTION OF FOULING IN GENERAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>OKAMOTO TADAO</creatorcontrib><creatorcontrib>TSUJIKAWA HIROTAKA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OKAMOTO TADAO</au><au>TSUJIKAWA HIROTAKA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE WASHING APPARATUS</title><date>2001-01-16</date><risdate>2001</risdate><abstract>PROBLEM TO BE SOLVED: To well wash the end surfaces of the peripheral edge part of a substrate in a substrate washing apparatus for the scrub-washing of the substrate. SOLUTION: A wafer W held and rotated by end surface support hands 100, 101 is washed while scrubbed with the scrubbing members 105, 109 of the scrubbing units 106, 110 rotated by a rotary drive source not shown in a drawing. Stepped parts D1, D2 capable of coming into contact with the end surfaces of the wafer W are formed to a part of the contact surfaces S1, S2 of the scrubbing members 105, 109.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING |
| title | SUBSTRATE WASHING APPARATUS |
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