SUBSTRATE WASHING APPARATUS

PROBLEM TO BE SOLVED: To well wash the end surfaces of the peripheral edge part of a substrate in a substrate washing apparatus for the scrub-washing of the substrate. SOLUTION: A wafer W held and rotated by end surface support hands 100, 101 is washed while scrubbed with the scrubbing members 105,...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: OKAMOTO TADAO, TSUJIKAWA HIROTAKA
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To well wash the end surfaces of the peripheral edge part of a substrate in a substrate washing apparatus for the scrub-washing of the substrate. SOLUTION: A wafer W held and rotated by end surface support hands 100, 101 is washed while scrubbed with the scrubbing members 105, 109 of the scrubbing units 106, 110 rotated by a rotary drive source not shown in a drawing. Stepped parts D1, D2 capable of coming into contact with the end surfaces of the wafer W are formed to a part of the contact surfaces S1, S2 of the scrubbing members 105, 109.