MOUNTING METHOD FOR ELECTRONIC PART
PROBLEM TO BE SOLVED: To provide a mounting method for a BGA(ball grid array) by junctioning via mutual electrodes on a printed circuit board and in which a life against thermal fatigue is effectively improved while the crushing of melted solder is suppressed. SOLUTION: In this mounting method, sold...
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| creator | OGISO HOMARE HIRAMATSU TOMOYUKI SONOBE TOSHIO |
| description | PROBLEM TO BE SOLVED: To provide a mounting method for a BGA(ball grid array) by junctioning via mutual electrodes on a printed circuit board and in which a life against thermal fatigue is effectively improved while the crushing of melted solder is suppressed. SOLUTION: In this mounting method, solder paste 50 is printed on electrodes 21 on a whole surface of a printed circuit board 20, thermosetting resin 41 is applied at the center excepting the electrode area. After that, a BGA 10 having a solder ball 14 on a surface is so mounted on the surface of the printed circuit board 20 as the electrodes 11 and 21 to contact via each solder 14 and 50. At the next process, the solder is melted, additionally the thermosetting resin is so semi-cured as displacement correction of the BGA 10 corresponding to the printed circuit board 20 and crushing suppression of the solder in the heightwise direction to be possible and coagulation of the solder and curing of the thermosetting resin 41 are subsequently performed. |
| format | Patent |
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SOLUTION: In this mounting method, solder paste 50 is printed on electrodes 21 on a whole surface of a printed circuit board 20, thermosetting resin 41 is applied at the center excepting the electrode area. After that, a BGA 10 having a solder ball 14 on a surface is so mounted on the surface of the printed circuit board 20 as the electrodes 11 and 21 to contact via each solder 14 and 50. At the next process, the solder is melted, additionally the thermosetting resin is so semi-cured as displacement correction of the BGA 10 corresponding to the printed circuit board 20 and crushing suppression of the solder in the heightwise direction to be possible and coagulation of the solder and curing of the thermosetting resin 41 are subsequently performed.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2001</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010112&DB=EPODOC&CC=JP&NR=2001007503A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010112&DB=EPODOC&CC=JP&NR=2001007503A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OGISO HOMARE</creatorcontrib><creatorcontrib>HIRAMATSU TOMOYUKI</creatorcontrib><creatorcontrib>SONOBE TOSHIO</creatorcontrib><title>MOUNTING METHOD FOR ELECTRONIC PART</title><description>PROBLEM TO BE SOLVED: To provide a mounting method for a BGA(ball grid array) by junctioning via mutual electrodes on a printed circuit board and in which a life against thermal fatigue is effectively improved while the crushing of melted solder is suppressed. SOLUTION: In this mounting method, solder paste 50 is printed on electrodes 21 on a whole surface of a printed circuit board 20, thermosetting resin 41 is applied at the center excepting the electrode area. After that, a BGA 10 having a solder ball 14 on a surface is so mounted on the surface of the printed circuit board 20 as the electrodes 11 and 21 to contact via each solder 14 and 50. At the next process, the solder is melted, additionally the thermosetting resin is so semi-cured as displacement correction of the BGA 10 corresponding to the printed circuit board 20 and crushing suppression of the solder in the heightwise direction to be possible and coagulation of the solder and curing of the thermosetting resin 41 are subsequently performed.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2001</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD29Q_1C_H0c1fwdQ3x8HdRcPMPUnD1cXUOCfL383RWCHAMCuFhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGBoYGBuamBsaOxkQpAgCi3CMa</recordid><startdate>20010112</startdate><enddate>20010112</enddate><creator>OGISO HOMARE</creator><creator>HIRAMATSU TOMOYUKI</creator><creator>SONOBE TOSHIO</creator><scope>EVB</scope></search><sort><creationdate>20010112</creationdate><title>MOUNTING METHOD FOR ELECTRONIC PART</title><author>OGISO HOMARE ; HIRAMATSU TOMOYUKI ; SONOBE TOSHIO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2001007503A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2001</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>OGISO HOMARE</creatorcontrib><creatorcontrib>HIRAMATSU TOMOYUKI</creatorcontrib><creatorcontrib>SONOBE TOSHIO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OGISO HOMARE</au><au>HIRAMATSU TOMOYUKI</au><au>SONOBE TOSHIO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MOUNTING METHOD FOR ELECTRONIC PART</title><date>2001-01-12</date><risdate>2001</risdate><abstract>PROBLEM TO BE SOLVED: To provide a mounting method for a BGA(ball grid array) by junctioning via mutual electrodes on a printed circuit board and in which a life against thermal fatigue is effectively improved while the crushing of melted solder is suppressed. SOLUTION: In this mounting method, solder paste 50 is printed on electrodes 21 on a whole surface of a printed circuit board 20, thermosetting resin 41 is applied at the center excepting the electrode area. After that, a BGA 10 having a solder ball 14 on a surface is so mounted on the surface of the printed circuit board 20 as the electrodes 11 and 21 to contact via each solder 14 and 50. At the next process, the solder is melted, additionally the thermosetting resin is so semi-cured as displacement correction of the BGA 10 corresponding to the printed circuit board 20 and crushing suppression of the solder in the heightwise direction to be possible and coagulation of the solder and curing of the thermosetting resin 41 are subsequently performed.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | MOUNTING METHOD FOR ELECTRONIC PART |
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