MOUNTING METHOD FOR ELECTRONIC PART

PROBLEM TO BE SOLVED: To provide a mounting method for a BGA(ball grid array) by junctioning via mutual electrodes on a printed circuit board and in which a life against thermal fatigue is effectively improved while the crushing of melted solder is suppressed. SOLUTION: In this mounting method, solder paste 50 is printed on electrodes 21 on a whole surface of a printed circuit board 20, thermosetting resin 41 is applied at the center excepting the electrode area. After that, a BGA 10 having a solder ball 14 on a surface is so mounted on the surface of the printed circuit board 20 as the electrodes 11 and 21 to contact via each solder 14 and 50. At the next process, the solder is melted, additionally the thermosetting resin is so semi-cured as displacement correction of the BGA 10 corresponding to the printed circuit board 20 and crushing suppression of the solder in the heightwise direction to be possible and coagulation of the solder and curing of the thermosetting resin 41 are subsequently performed.