PRINTED CIRCUIT BOARD FOR LAMB BUS

PROBLEM TO BE SOLVED: To hold a deviation of a thickness by respectively laminating a first insulating layer and a second insulating layer on both sides of a first thin copper laminate, and providing at least specific numbers of second thin copper laminates and third thin copper laminates in which thin coppers adhered to opposed positions on the first and second insulating layers are adhered to both sides. SOLUTION: Thin coppers of both sides of a first thin copper laminate 101 and a second thin copper laminate 104 are etched to form circuits 103a, 103b, 106a and 106b, and a first insulating layer 116 made of an insulating substance like a prepreg is laminated therebetween. Second and third insulating layers 118, 120 are laminated on the laminates 101, 104, respectively. The layers 118, 120 are also formed of prepregs, and the laminates 101 and 104 are adhered to the at least third and fourth thin copper laminates 108, 112, respectively. According to this constitution, since the prepreg layers are reduced, a deviation of the thickness of the entirety due to flowability of the prepreg when boards are laminated can be reduced.