MANUFACTURE OF CHIP CAPACITOR

PROBLEM TO BE SOLVED: To obtain a method by which a small-sized chip capacitor can be manufactured. SOLUTION: In a method for manufacturing chip capacitor, a lead frame 30 is formed of terminal sets composed of a plate-like anode terminal constituting section 40 and a cathode terminal constituting section 38 each faced to the section 40 with a prescribed internal between their front ends in the same plane and provided in a frame-like body 32 in both the longitudinal and transversal direction. Then capacitor elements each of which has a cathode layer 6 on its outer peripheral surface and from which a tantalum wire 8 is lead out are formed. The capacitor elements 4 are respectively arranged on the terminal constitution sets and the tantalum wires 8 are respectively coupled with one faces of the anode terminal constituting sections 40. In addition, the cathode layers 6 are respectively connected to the surfaces of the cathode constituting sections 38 of the sets. At least, part of the surface of each anode terminal constituting section 40 opposite to the surface coupled with the wire 8, and at least part of the surface of each cathode terminal constituting section 38 opposite to the surface coupled with the cathode layer 6, are exposed and the lead frame 30 is coated with a resin with all capacitor element inside. Finally, the frame 30 is cut into pieces so as to separate the anode and cathode terminal constituting sections 40 and 38 from the frame body 32.