ELECTROLESS PALLADIUM-MOLYBDENUM ALLOY PLATING SOLUTION AND PLATING METHOD

PROBLEM TO BE SOLVED: To prepare an electroless palladium-molybdenum alloy plating soln. with which a plating layer excellent in bonding properties an solder joinability is obtained, and to provide a plating method. SOLUTION: This electroless palladium-molybdenum alloy plating soln. is obtd. by addi...

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Bibliographische Detailangaben
Hauptverfasser:	SERIZAWA SEIICHI, IGAWA MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prepare an electroless palladium-molybdenum alloy plating soln. with which a plating layer excellent in bonding properties an solder joinability is obtained, and to provide a plating method. SOLUTION: This electroless palladium-molybdenum alloy plating soln. is obtd. by adding a molybdenum compd. to an electroless palladium plating soln. contg. a palladium compd., a reducing agent selected from formic acid and the salts thereof, hypophosphorous acid and the salts thereof, phosphorous acid and the salts thereof, a boron hydroxide compd. and amine boranes, a complexing agent selected from ammonia and amines, a buffer selected from carbonic acid and borates and a stabilizer selected from a sulfur compd. and a lead compd.