METHOD OF LAMINATING FILMY ORGANIC DIE-BONDING MATERIAL, DIE-BONDING METHOD, LAMINATING APPARATUS, DIE BONDER, SEMICONDUCTOR DEVICE AND MANUFACTURING THE SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method and an apparatus for laminating a filmy organic die-bonding material by continuously heating and compression-bonding it on a lead frame. SOLUTION: A lead frame 7 is carried and heated on a running table 8, a filmy organic die-bonding material 2 is punched through, a film is provisionally adhered to a die pad on the lead frame 7, it is moved by the running table 8 to a position B and pressed to compression-bond at the position B by a crimping piece 9, and a semiconductor chip is mounted on the die-bonding material 2. Thus the filmy organic die-bonding material 2 can be compression-bonded to the lead frame 7 with satisfactory productivity, without bonding and to avoid package cracks in mounting of a semiconductor device.