CONDITIONING FIXED ABRASIVE MEMBER

PROBLEM TO BE SOLVED: To prolong the service life of a fixed abrasive member, and at the same time, to highly stabilize the polishing speeds of wafers. SOLUTION: When fixed abrasive elements 110 are preconditioned and/or periodically preconditioned after a fixed abrasive member 110 is first used for...

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Bibliographische Detailangaben
Hauptverfasser:	FRITZ C REDECKER, LI SHIJIAN, JOHN M WHITE, EMAMI RAMIN, SIDNEY HUEY
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prolong the service life of a fixed abrasive member, and at the same time, to highly stabilize the polishing speeds of wafers. SOLUTION: When fixed abrasive elements 110 are preconditioned and/or periodically preconditioned after a fixed abrasive member 110 is first used for polishing a wafer 10, the service life of the member 110 is prolonged, and the uniformity among wafers is improved. One example of such a member includes preconditioning that is performed by exposing abrasive particles having the same density as bulk density, at about half the height of the abrasive elements, by forcibly removing the binder-rich upper parts of the abrasive elements. The member also includes such periodical preconditioning, that is performed by forcibly removing the upper parts of the abrasive elements, after the member 110 is first used for polishing a wafer.