DIVIDED ITO SPUTTERING TARGET

PROBLEM TO BE SOLVED: To reduce the amt. of nodules to be generated in the surroundings of a divided part by controlling the relative density of each sintered body to the value equal to or above a specified one, controlling the width of the divided part formed by the adjacent sintered bodies to a sp...

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Hauptverfasser: UCHIUMI KENTARO, KUROSAWA SATOSHI
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creator UCHIUMI KENTARO
KUROSAWA SATOSHI
description PROBLEM TO BE SOLVED: To reduce the amt. of nodules to be generated in the surroundings of a divided part by controlling the relative density of each sintered body to the value equal to or above a specified one, controlling the width of the divided part formed by the adjacent sintered bodies to a specified range and moreover controlling the average line center roughness of each sintered body relative in the divided part to a specified range. SOLUTION: The relative density of ITO sintered bodies 2 to be used is controlled to >=99%. The plural pieces of ITO sintered bodies 2 are arranged side by side on a backing plate 1 to form into a divided ITO target. Individual ITO sintered bodies 2 are respectively arranged with the width (the width 4 of the divided part) of 0.05 to 0.2 mm each other. At the time of subjecting the ITO sintered bodies 2 to grinding working to form into desired dimensions, the average line center roughness (Ra) of the faces composing the divided part is worked into 0.5 to 1 μm. Moreover, the edge part 3 in which the sputtering face and the face composing the divided part are crossed is worked preferably to R 0.5 to 2.
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SOLUTION: The relative density of ITO sintered bodies 2 to be used is controlled to &gt;=99%. The plural pieces of ITO sintered bodies 2 are arranged side by side on a backing plate 1 to form into a divided ITO target. Individual ITO sintered bodies 2 are respectively arranged with the width (the width 4 of the divided part) of 0.05 to 0.2 mm each other. At the time of subjecting the ITO sintered bodies 2 to grinding working to form into desired dimensions, the average line center roughness (Ra) of the faces composing the divided part is worked into 0.5 to 1 μm. 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subjects ARTIFICIAL STONE
CEMENTS
CERAMICS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS
CONCRETE
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
LIME, MAGNESIA
METALLURGY
REFRACTORIES
SLAG
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
TREATMENT OF NATURAL STONE
title DIVIDED ITO SPUTTERING TARGET
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