METHOD OF REPAIRING CIRCUIT BOARD HAVING ELECTRONIC COMPONENT MOUNTED THEREON

PROBLEM TO BE SOLVED: To quickly and reliably remove only an insulating drip-proof film remaining at portions from which electronic components have been removed without affecting other components thereabout, in a method of repairing a circuit board for replacing the electronic components which are s...

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Hauptverfasser: OGISO HOMARE, FUJII JUNPEI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To quickly and reliably remove only an insulating drip-proof film remaining at portions from which electronic components have been removed without affecting other components thereabout, in a method of repairing a circuit board for replacing the electronic components which are sealed with the insulating drip-proof film thereon. SOLUTION: A partially dipping jig 6 having a frame part 6a is made to abut against a surface 1a of a circuit board 1 in a manner enclosing with the part 6a a mounting region from which an IC element 2 has been removed. Here, of the part 6a, an abutment part 6b which is abutted with the surface 1a of the board 1 is made of an elastic body. Then, a cleaning agent 8 is supplied to and stored in the hollow part of the part 6a, whereby an insulating drip-proof film 5 remaining at the mounting region is dissolved into the agent 8, and successively, the agent 8 is removed from the hollow part of the part 6a while maintaining the abutment state of the part 6b.