DEVICE FOR FORMING RESIST LAYER ON CONDUCTIVE SUBSTRATE

PROBLEM TO BE SOLVED: To obtain a device which can easily form a resist layer on a conductive substrate, at a low cost and without being influenced by the width of the land of a through-hole which can be protected from etchant without using filling ink. SOLUTION: A device for forming a resist layer on a conductive substrate with through-holes has a conveyer 12 which conveys the conductive substrate 10, application rolls 30 and 32 which are rotated in one direction for applying liquid resist to the conveyed conductive substrate 10, a coater which has a facing member facing the rolls 30 and 32 and a controller for controlling the conveyer and a paint feeder which feeds the surfaces of the application rolls with the paint and has chambers 61 and 62, and its controller controls the conveyer so as to convey the conductive substrate 10 in one conveying direction and then convey the substrate in the opposite conveying direction between the application rolls 30 and 32 and the facing member.