SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To suppress a semiconductor chip size from enlarging, and moisture from penetrating, without changing the package size by forming a seal resin in a range from the package cavity to the package end edges. SOLUTION: This semiconductor device has a semiconductor chip 5 mounted in...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	UJIIE MASATO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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