SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To suppress a semiconductor chip size from enlarging, and moisture from penetrating, without changing the package size by forming a seal resin in a range from the package cavity to the package end edges. SOLUTION: This semiconductor device has a semiconductor chip 5 mounted in a package cavity 3, and the chip 5 is sealed with resin. A sealing resin 9 is formed in a range extending from the package cavity 3 to the package end edges 2a, thereby expanding a penetration route L2 of moisture into the cavity 3 from the outside. Thus it is possible to suppress moisture penetration and improve reliability. Because of the existence of resin dams, the size limit of the semiconductor chip 5 mounted in the package is no longer placed and the chip 5 size can be increased, without changing the package size.