SUBSTRATE WARPING CORRECTION METHOD IN USE OF IN-CIRCUIT TESTER AND SUBSTRATE WARPING PREVENTION METHOD

PROBLEM TO BE SOLVED: To provide a general-purpose substrate warping correction method not related to a substrate pattern of an electronic package to be measured. SOLUTION: In this substrate warping correction method, a substrate is divided like a grid, the number of measuring pins to be provided in one square is calculated, and a position where warping of the substrate is corrected is obtained by taking the number and mounting positions of parts into account in measurement of in-circuit tester when the substrate sucked to bring the measuring pins into contact with it stably. A correction jig having mounting holes corresponding to correction pins and grid squares is prepared, the correction pin is set at a square position requiring correction, and pressure is applied to correct warping of the substrate.