RESIN COMPOSITION FOR CALENDER MOLDING, FILM AND PRESSURE-SENSITIVE ADHESIVE TAPE OR SHEET

PROBLEM TO BE SOLVED: To provide a polyolefinic resin composition improved in roll release properties when calendered on film formation enough to give a film improved in flatness, a film (especially, a film composed of this composition) and a pressure-sensitive adhesive tape or sheet comprising this...

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Bibliographische Detailangaben
Hauptverfasser:	SHIRAI WAKAHITO, YONEDA MASANOBU, GOTO KAZUHITO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES GENERAL PROCESSES OF COMPOUNDING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a polyolefinic resin composition improved in roll release properties when calendered on film formation enough to give a film improved in flatness, a film (especially, a film composed of this composition) and a pressure-sensitive adhesive tape or sheet comprising this film as a substrate. SOLUTION: The title resin composition for calender molding comprises the following components A and B, the component B being compounded in an amount of 1-50 pts.wt. based on 100 pts.wt. of the component A. The component A: a polyethylenic resin having a softening point of 60-140 deg.C. The component B: a copolymer of propylene with a compound having at least one double bond in a molecule. Further, 1-50 pts.wt., based on 100 pts.wt. of the resin (the component A), of a propylene resin are desirably compounded as a component C.