STENCIL MASK FOR ELECTRON BEAM EXPOSURE

PROBLEM TO BE SOLVED: To settle occurrence of thermal distortion under heat for suppressed failure in a mask pattern by bonding/fitting a stencil mask main body for electron beam exposure to a conductive supporter surface by one point. SOLUTION: The lower surface along one side of a stencil mask main body 10 is bonded/fitted to the upper surface of recessed part of a metal holder 15 by one point. The position for bonding/fitting with an adhesive 16 does not extend to the entire perimeter of the stencil mask main body 10 but limited to any one point. There is a large difference in linear expansion factor between the stencil mask main body 10 and the metal holder 15. No compression stress due to thermal distortion is applied on the mask main body 10 even if bonding with the adhesive 16 is processed through high-temperature heating or cooling to a room temperature, since the part other than the bonding point is free. The less the area of the region of that one point for bonding, the batter the bonding effect. If the area has a diameter four times of the thickness of the mask main body 10 or less, no effect of thermal distortion occurring in the bonding region is presented.