SUBSTRATE TREATER AND SUBSTRATE TREATING METHOD

PROBLEM TO BE SOLVED: To enhance the uniformity of a treatment of substrates and to raise the yield of the manufacture of the substrates by controlling the temperature of the substrates with high accuracy, in a coating and developing device of a structure wherein a resist, for example, is applied on the surfaces of the substrates and the substrates subsequent to an exposure of the surfaces of the substrates are subjected to a developing treatment. SOLUTION: A substrate treater is constituted into such a structure that a coating station S2 for coating a resist on the surfaces of wafers W and a developing station S3 for performing an application of a developing solution are connected with a cassette station S1 for carrying a wafer cassette 22. In the station S3, the wafers W are heated in a heating part, then the wafers W are cooled to a temperature lower than a first temperature in a first cooling part. Subsequently, the wafers W are cooled to a second temperature lower than the first temperature in a second cooling part, and after that, the application of the developing liquid is performed in a developing unit.