BURN-IN DEVICE AND BURN-IN METHOD

PROBLEM TO BE SOLVED: To provide a burn-in device capable of individually controlling temperature of a plurality of devices to be measured, and of making quick their temperature change response to the temperature control so as to precisely control the temperatures. SOLUTION: A burn-in socket 7 is pr...

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Bibliographische Detailangaben
1. Verfasser:	NAKAO KYOSUKE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES MEASURING QUANTITY OF HEAT MEASURING TEMPERATURE PHYSICS SEMICONDUCTOR DEVICES TESTING THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a burn-in device capable of individually controlling temperature of a plurality of devices to be measured, and of making quick their temperature change response to the temperature control so as to precisely control the temperatures. SOLUTION: A burn-in socket 7 is provided which is mounted on a burn-in board and formed with an engaging opening in its top surface to hold a device 9 to be measured. A heat block 8 is provided which is detachably fitted in a fitting opening so as to contact a top surface of the device 9 to be measured stored in the opening. A heater is provide which is disposed inside the heat block 8 to heat it. A heat block temperature sensor is provided which is disposed inside the heat block 8 to detect temperature θh the heat block 8.