EPOXY RESIN SEALING MATERIAL

PROBLEM TO BE SOLVED: To obtain a sealing material which is excellent in storage stability, flexibility after curing, and adhesion to substrates and quickly cures by moisture at normal temperature by compounding a specific heterocyclic compound with a polyepoxy compound as a latent curing agent. SOL...

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Bibliographische Detailangaben
Hauptverfasser:	HONDO FUMIAKI, SAITO HIDEAKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a sealing material which is excellent in storage stability, flexibility after curing, and adhesion to substrates and quickly cures by moisture at normal temperature by compounding a specific heterocyclic compound with a polyepoxy compound as a latent curing agent. SOLUTION: This sealing material comprises a heterocyclic compound having at least two heterocyclic groups represented by the formula and a polyepoxy compound. In the formula, R is a 2-10C linear or branched alkylene group optionally containing O and/or S; R1 and R2 are each independently H, a 1-6C linear or branched alkyl or alkenyl group or a 6-8C aryl group provided they may combine with each other to form, together with a carbon atom to which they are bonded, a 5-7C cycloalkyl group; and R3 is a 1-10C alkylene. Examples of the heterocyclic compound are the ones having main chains selected from among hydrocarbons, polyethers, or the like, having hydroxyl groups on the side chains.