BACKING PAD STRUCTURE

PROBLEM TO BE SOLVED: To facilitate separating work by a transfer device by preventing any adhesion of templates to abrasive cloth. SOLUTION: A backing pad structure 1 comprises a backing pad 2 and a template 3 fixed to the backing pad 2 via an adhesive 5. The template 3 has a water-repellent surfac...

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Bibliographische Detailangaben
Hauptverfasser:	TOIKAWA MASAYUKI, KIYONO TOSHIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To facilitate separating work by a transfer device by preventing any adhesion of templates to abrasive cloth. SOLUTION: A backing pad structure 1 comprises a backing pad 2 and a template 3 fixed to the backing pad 2 via an adhesive 5. The template 3 has a water-repellent surface or a surface roughness Ra of 0.5 μm or more. With a semiconductor wafer 20 positioned in a semiconductor wafer holding hole in the template 3, relative movement of the backing pad structure 1 and a surface plate 15, when polishing fluid 21 is,supplied between the semiconductor wafer 20 and abrasive cloth 16, causes the abrasive cloth 16 to polish the polishing surface of the semiconductor wafer 20 and the surface of the template 3, which never adheres to the abrasive cloth 16 after the polishing.