WORKPIECE POLISHING METHOD

PROBLEM TO BE SOLVED: To speed up polishing by setting a high temperature of polishing fluid. SOLUTION: A plurality of typically granulated or pelletized polishing tools 3 of abrasive grains softer than a workpiece 6 are stuck to a surface plate 2, and the workpiece 6, such as a silicon wafer, is st...

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Bibliographische Detailangaben
Hauptverfasser:	AIZAWA TOMOHIRO, KIYONO TOSHIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To speed up polishing by setting a high temperature of polishing fluid. SOLUTION: A plurality of typically granulated or pelletized polishing tools 3 of abrasive grains softer than a workpiece 6 are stuck to a surface plate 2, and the workpiece 6, such as a silicon wafer, is stuck to a sticking plate 5 on a pressure plate 4. Polishing fluid 7 of an alkaline solution heated in the range of 30 to 100 deg.C is supplied between the polishing tools 3 and the workpiece 6, in which condition, rotating both of them in relatively different directions generates frictional force between them to provide chemical/mechanical polishing of the polishing surface of the workpiece 6.