WAFER HOLDING CHUCK

PROBLEM TO BE SOLVED: To peel off a wafer from a base table easily and in a short time. SOLUTION: A base table 2 is provided with a groove for vacuum suction on its surface, and a fluid hole 7 in its central part that is drilled from the surface side to backside and is communicated with the groove for vacuum chuck. Further, it is provided with a plurality of escape holes 8 drilled from the surface side to backside. A wafer 15 is placed on the surface of the base table 2 and an air is evacuated from the groove for vacuum chuck through the fluid hole 7, so that the wafer 15 is vacuum-chucked onto the surface of the base table 2. When a destructive water is fed by pressure into the groove for vacuum chuck through the fluid hole 7, a part thereof overflows from the groove and flown into the escape hole 8, and it runs from the hole 8 to the backside of the base table 2. As a result, a tensile strength due to the destructive water working on the wafer 15 can be reduced.