HEADER TERMINAL PROVIDED AT COF SUBSTRATE

PROBLEM TO BE SOLVED: To form a header terminal of a COF substrate where only a part required for inserting a socket is reinforced by bending the COF substrate and overlapping it with the other main surface of the COF substrate for sealing. SOLUTION: In the form where the end part of an input termin...

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Bibliographische Detailangaben
1. Verfasser:	SHIROKURA HIDEAKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADVERTISING BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CRYPTOGRAPHY DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DISPLAY DISPLAYING EDUCATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING LABELS OR NAME-PLATES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS PRINTED CIRCUITS SEALS SEMICONDUCTOR DEVICES SIGNS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To form a header terminal of a COF substrate where only a part required for inserting a socket is reinforced by bending the COF substrate and overlapping it with the other main surface of the COF substrate for sealing. SOLUTION: In the form where the end part of an input terminal 5 of a COF substrate 2 is defined to be an electrode tip part 8 and the electrode tip part 8 is bent to the reverse side, adhesion and fixation are made on a main surface that is opposite to the main surface where an IC chip 7 is placed as a header terminal 3. The bending here indicates that the electrode tip part 8 is bent so that the electrode tip part 8 cannot be caught at the inside, which is not limited to the main surface where the IC chip 7 exists. Also, the header terminal 3 is glued while two COF substrates are overlapped. Therefore, when the thickness of an adhesive is not considered, the thickness becomes two times larger than the other region of the COF substrate and the header terminal has a sufficient hardness for inserting into a female socket.