SEMICONDUCTOR CASE AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To easily prevent a semiconductor case from changing in electrical characteristics due to width change in the alumina paste layer or a shape change in wirings so as to improve it in yield, wherein a frame layer is laminated on a wiring board through the intermediary of an aluminum paste layer, bonded with pressure, and backed for formation of the semiconductor case. SOLUTION: A frame layer 2 is punched out from a ceramic green sheet 3, alumina paste 4 is applied beforehand on the frame layer 2, and the frame layer 2 is laminated on a wiring board 6 which serves as a base board, bonded with pressure, and baked together with the wiring board 6. Since the alumina paste 4 is applied beforehand on the frame layer 2, a part of the alumina paste 4 protruding from an extension of the side face of the frame layer 2 can be easily regulated in width, so that wirings can match well in impedance and prevented from changing in line characteristics. Furthermore, the alumina paste 4 is formed beforehand on the frame layer 4, so that there is no need for the applied alumina paste layer 4 and the frame layer 2 to be aligned to each other.