PASTE APPLYING DEVICE AND METHOD

PROBLEM TO BE SOLVED: To provide a paste applying device which is capable of discharging paste uniformly from an applying nozzle and a paste applying method. SOLUTION: A paste application method is carried out through a manner where an application nozzle 15a is moved with paste 7 discharged, and the...

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Bibliographische Detailangaben
Hauptverfasser:	SUEFUJI NOBUYUKI, OSONO MITSURU, IWASHITA NOBUYUKI, MUKOJIMA HITOSHI, SATO SEIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a paste applying device which is capable of discharging paste uniformly from an applying nozzle and a paste applying method. SOLUTION: A paste application method is carried out through a manner where an application nozzle 15a is moved with paste 7 discharged, and the paste 7 is applied to an application area demarcated on a lead frame drawing application lines L1 and L2. When the application nozzle 15a is moved based on data as to an application pattern, the intersection height H2 of the application nozzle 15a is controlled by a nozzle height control means at an intersection of the application line L1 and the application line L2 where paste 7 is applied already so as to be higher than an application height H1. By this setup, the paste 7 can be stably discharged at the intersection.