ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE AND PARTS USING THE SAME ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To form an adhesive sheet for semiconductor devices, enabling the problem of heat generated from high-speed operation to be dissolved and excellent in reflowing resistance, a thermal cycling property and heat dissipation by specifying the heat conductivity. SOLUTION: The heat c...
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| creator | TAKAHASHI HIDEO NAGAI KAZUMI SAWAMURA TAIJI |
| description | PROBLEM TO BE SOLVED: To form an adhesive sheet for semiconductor devices, enabling the problem of heat generated from high-speed operation to be dissolved and excellent in reflowing resistance, a thermal cycling property and heat dissipation by specifying the heat conductivity. SOLUTION: The heat conductivity of this adhesive sheet for semiconductor devices is made to show >=0.15 W/mK (preferably >=0.2 W/mK) at 100 deg.C. The objective sheet is preferably made of a composition comprising (A) an epoxy resin (e.g. cresol novolak-type epoxy resin, or the like), (B) a thermoplastic resin (e.g. acrylonitrile-butadiene copolymer, or the like) and (C) an organic filler, and the ingredient C contains at least one kind selected from the group consisting of crystalline silica, aluminum oxide, aluminum hydroxide, silicon nitride and silicon carbide. The ingredient C is included in the content of preferably >=5 wt.% and has preferably an average particle diameter of |
| format | Patent |
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SOLUTION: The heat conductivity of this adhesive sheet for semiconductor devices is made to show >=0.15 W/mK (preferably >=0.2 W/mK) at 100 deg.C. The objective sheet is preferably made of a composition comprising (A) an epoxy resin (e.g. cresol novolak-type epoxy resin, or the like), (B) a thermoplastic resin (e.g. acrylonitrile-butadiene copolymer, or the like) and (C) an organic filler, and the ingredient C contains at least one kind selected from the group consisting of crystalline silica, aluminum oxide, aluminum hydroxide, silicon nitride and silicon carbide. The ingredient C is included in the content of preferably >=5 wt.% and has preferably an average particle diameter of <=10 μm and the maximum particle diameter of <=30 μm.</description><edition>7</edition><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2000</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20001003&DB=EPODOC&CC=JP&NR=2000273409A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20001003&DB=EPODOC&CC=JP&NR=2000273409A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKAHASHI HIDEO</creatorcontrib><creatorcontrib>NAGAI KAZUMI</creatorcontrib><creatorcontrib>SAWAMURA TAIJI</creatorcontrib><title>ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE AND PARTS USING THE SAME ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE</title><description>PROBLEM TO BE SOLVED: To form an adhesive sheet for semiconductor devices, enabling the problem of heat generated from high-speed operation to be dissolved and excellent in reflowing resistance, a thermal cycling property and heat dissipation by specifying the heat conductivity. SOLUTION: The heat conductivity of this adhesive sheet for semiconductor devices is made to show >=0.15 W/mK (preferably >=0.2 W/mK) at 100 deg.C. The objective sheet is preferably made of a composition comprising (A) an epoxy resin (e.g. cresol novolak-type epoxy resin, or the like), (B) a thermoplastic resin (e.g. acrylonitrile-butadiene copolymer, or the like) and (C) an organic filler, and the ingredient C contains at least one kind selected from the group consisting of crystalline silica, aluminum oxide, aluminum hydroxide, silicon nitride and silicon carbide. 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SOLUTION: The heat conductivity of this adhesive sheet for semiconductor devices is made to show >=0.15 W/mK (preferably >=0.2 W/mK) at 100 deg.C. The objective sheet is preferably made of a composition comprising (A) an epoxy resin (e.g. cresol novolak-type epoxy resin, or the like), (B) a thermoplastic resin (e.g. acrylonitrile-butadiene copolymer, or the like) and (C) an organic filler, and the ingredient C contains at least one kind selected from the group consisting of crystalline silica, aluminum oxide, aluminum hydroxide, silicon nitride and silicon carbide. The ingredient C is included in the content of preferably >=5 wt.% and has preferably an average particle diameter of <=10 μm and the maximum particle diameter of <=30 μm.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE AND PARTS USING THE SAME ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE |
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