ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE AND PARTS USING THE SAME ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To form an adhesive sheet for semiconductor devices, enabling the problem of heat generated from high-speed operation to be dissolved and excellent in reflowing resistance, a thermal cycling property and heat dissipation by specifying the heat conductivity. SOLUTION: The heat conductivity of this adhesive sheet for semiconductor devices is made to show >=0.15 W/mK (preferably >=0.2 W/mK) at 100 deg.C. The objective sheet is preferably made of a composition comprising (A) an epoxy resin (e.g. cresol novolak-type epoxy resin, or the like), (B) a thermoplastic resin (e.g. acrylonitrile-butadiene copolymer, or the like) and (C) an organic filler, and the ingredient C contains at least one kind selected from the group consisting of crystalline silica, aluminum oxide, aluminum hydroxide, silicon nitride and silicon carbide. The ingredient C is included in the content of preferably >=5 wt.% and has preferably an average particle diameter of