SEMICONDUCTOR DEVICE, ITS MANUFACTURE, AND METHOD FOR MOUNTING THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor device which can ultimately shorten the wiring in a package and on a mounting substrate and the manufacturing cost which can reduce. SOLUTION: A semiconductor device is provided with a semiconductor chip 11 on which pads 12 for outside connection are formed in a row, a resin thin film on one surface of which a plurality of wiring is printed and contact holes are formed in rows at the sections corresponding to each part of the printed wiring, an adhesive which bonds the surface of the printed wiring of the resin thin film to the pad forming surface of the chip 11 in such a way that the printed wiring section positioned to the contact hole section of the resin thin film faces the pads 12 of the chip 11. The semiconductor device is also provided with connecting members which electrically connect the printed wiring sections in the contact hole section of the resin thin film to the corresponding pads 12 of the chip 11 in a contact hole.