THERMAL LOAD TEST METHOD FOR PACKAGED SEMICONDUCTOR PART

PROBLEM TO BE SOLVED: To reduce the occurrence of cracking with a semiconductor chip of a shipped product at soldering, related to a semiconductor part wherein a semiconductor chip is packaged with a package body. SOLUTION: Semiconductor parts 1 are shipped except for what generates cracking at a thermal load test. Such thermal load condition is set at the thermal load test as no lead terminal is oxidized or discolored while the occurrence of cracking at the semiconductor chip is at least one per thousand at the thermal load test for a test semiconductor part manufactured of a semiconductor chip with a scar provided in advance.