ALIGNMENT METHOD

PROBLEM TO BE SOLVED: To realize an alignment method where proper alignment is performed, even in the case an object part of recognition for a warer is included in an object part of recognition for a photomask, when alignment of the photomask and the wafer is made under conditions with exposure disabled. SOLUTION: After alignment of a photomask 6 and a first sheet of wafer 4 mounted on a wafer stage 3 is made under conditions with exposure disable by using each object part of recognition by a manual operation, the wafer stage 3 is so transferred to a predetermined transfer value X as the predetermined object part of recognition of the first sheet of the wafer 4 which is not to be included in the predetermined recognition objecting part of the photomask 6, and both images of the predetermined recognition objecting parts at the moment are stored as standard images. After a next wafer 4 in stead is subsequently surmounted on the wafer stage 3, each image of a prescribed object part of recognition of the next wafer 4 and the photomask 6 is input, and after so adjusting the position on the wafer stage 3 as to have the input images correspond to standard images, alignment is made under conditions of exposure enabled, by transferring the wafer stage 3 to a prescribed transfer value X in the opposite direction.