EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which can control the release of the hydrolyzable chlorine atoms of an epoxy resin and can exhibit excellent moisture-resistant reliability, excellent moldability, and the like, by using a specific compound as a curing accelerator. SOLUTION:...
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| creator | OKI HIROMI |
| description | PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which can control the release of the hydrolyzable chlorine atoms of an epoxy resin and can exhibit excellent moisture-resistant reliability, excellent moldability, and the like, by using a specific compound as a curing accelerator. SOLUTION: This epoxy resin composition comprises (A) an epoxy resin, (B) a phenolic resin (preferably a phenolaralkyl resin), (C) N-benzylpiperazine or the salt of the N-benzylpiperazine with succinic acid, and (D) an inorganic filler as essential components. Therein, the equivalent ratio of the epoxy group of the component A to the phenolic hydroxyl groups of the component B is 0.5-2, and the component D is added in an amount of 200-2,400 pts.wt. per 100 pts.wt. of the total amount of the components A and B. The component A is preferably an epoxy resin of the formula [R1 is a 1-6C alkyl or a halogen; (1) is 0, 1, 2 or 3; (n) is 0 or a positive integer of 1-6 on the average] having a softening point of 50-90 deg.C. The composition can provide semiconductor devices which can correspond to insertion mounting and surface mounting. |
| format | Patent |
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SOLUTION: This epoxy resin composition comprises (A) an epoxy resin, (B) a phenolic resin (preferably a phenolaralkyl resin), (C) N-benzylpiperazine or the salt of the N-benzylpiperazine with succinic acid, and (D) an inorganic filler as essential components. Therein, the equivalent ratio of the epoxy group of the component A to the phenolic hydroxyl groups of the component B is 0.5-2, and the component D is added in an amount of 200-2,400 pts.wt. per 100 pts.wt. of the total amount of the components A and B. The component A is preferably an epoxy resin of the formula [R1 is a 1-6C alkyl or a halogen; (1) is 0, 1, 2 or 3; (n) is 0 or a positive integer of 1-6 on the average] having a softening point of 50-90 deg.C. 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SOLUTION: This epoxy resin composition comprises (A) an epoxy resin, (B) a phenolic resin (preferably a phenolaralkyl resin), (C) N-benzylpiperazine or the salt of the N-benzylpiperazine with succinic acid, and (D) an inorganic filler as essential components. Therein, the equivalent ratio of the epoxy group of the component A to the phenolic hydroxyl groups of the component B is 0.5-2, and the component D is added in an amount of 200-2,400 pts.wt. per 100 pts.wt. of the total amount of the components A and B. The component A is preferably an epoxy resin of the formula [R1 is a 1-6C alkyl or a halogen; (1) is 0, 1, 2 or 3; (n) is 0 or a positive integer of 1-6 on the average] having a softening point of 50-90 deg.C. The composition can provide semiconductor devices which can correspond to insertion mounting and surface mounting.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HETEROCYCLIC COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE |
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