EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which can control the release of the hydrolyzable chlorine atoms of an epoxy resin and can exhibit excellent moisture-resistant reliability, excellent moldability, and the like, by using a specific compound as a curing accelerator. SOLUTION: This epoxy resin composition comprises (A) an epoxy resin, (B) a phenolic resin (preferably a phenolaralkyl resin), (C) N-benzylpiperazine or the salt of the N-benzylpiperazine with succinic acid, and (D) an inorganic filler as essential components. Therein, the equivalent ratio of the epoxy group of the component A to the phenolic hydroxyl groups of the component B is 0.5-2, and the component D is added in an amount of 200-2,400 pts.wt. per 100 pts.wt. of the total amount of the components A and B. The component A is preferably an epoxy resin of the formula [R1 is a 1-6C alkyl or a halogen; (1) is 0, 1, 2 or 3; (n) is 0 or a positive integer of 1-6 on the average] having a softening point of 50-90 deg.C. The composition can provide semiconductor devices which can correspond to insertion mounting and surface mounting.