CREAM SOLDER AND FLUX FOR CREAM SOLDER
PROBLEM TO BE SOLVED: To prevent the development of change with the lapse of time during storing or during leaving till reflowing after coating on a substrate by kneading solder powder with flux base, solvent and liquid or pasty flux containing thixo agent and acetylene alcohol based compound. SOLUT...
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| creator | YOKOTA YUJI ISHIGA FUMIO YOSHIOKA TAKAYASU ISHIDA HIDEKI YOSHITOMI MANABU ISHIGURO YOSHINOBU TANAKA TAKASHI KOJIMA HIROMITSU SUDO EIICHI |
| description | PROBLEM TO BE SOLVED: To prevent the development of change with the lapse of time during storing or during leaving till reflowing after coating on a substrate by kneading solder powder with flux base, solvent and liquid or pasty flux containing thixo agent and acetylene alcohol based compound. SOLUTION: When a cream solder is prepared by kneading the solder powder and the liquid or pasty flux, further, or 100 pts.wt. of cream solder, about 0.005-1 pts.wt. desirably about 0.01-0.5 pts.wt. of the acetylene alcohol base compound is added and kneaded. This flux contains the flux base and the thixo agent and if necessary, contains an activator. As this acetylene alcohol base compound, 3-methyl-1-bulyn-3-ol,3-methyl-1-pentyne-3-ol,3,5-dimethyl-1-hexyne-3- ol,2,5- dimethyl-3-oxine-2,5-diol, etc., are desirably to be used. |
| format | Patent |
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SOLUTION: When a cream solder is prepared by kneading the solder powder and the liquid or pasty flux, further, or 100 pts.wt. of cream solder, about 0.005-1 pts.wt. desirably about 0.01-0.5 pts.wt. of the acetylene alcohol base compound is added and kneaded. This flux contains the flux base and the thixo agent and if necessary, contains an activator. As this acetylene alcohol base compound, 3-methyl-1-bulyn-3-ol,3-methyl-1-pentyne-3-ol,3,5-dimethyl-1-hexyne-3- ol,2,5- dimethyl-3-oxine-2,5-diol, etc., are desirably to be used.</description><edition>7</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2000</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20000926&DB=EPODOC&CC=JP&NR=2000263281A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20000926&DB=EPODOC&CC=JP&NR=2000263281A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOKOTA YUJI</creatorcontrib><creatorcontrib>ISHIGA FUMIO</creatorcontrib><creatorcontrib>YOSHIOKA TAKAYASU</creatorcontrib><creatorcontrib>ISHIDA HIDEKI</creatorcontrib><creatorcontrib>YOSHITOMI MANABU</creatorcontrib><creatorcontrib>ISHIGURO YOSHINOBU</creatorcontrib><creatorcontrib>TANAKA TAKASHI</creatorcontrib><creatorcontrib>KOJIMA HIROMITSU</creatorcontrib><creatorcontrib>SUDO EIICHI</creatorcontrib><title>CREAM SOLDER AND FLUX FOR CREAM SOLDER</title><description>PROBLEM TO BE SOLVED: To prevent the development of change with the lapse of time during storing or during leaving till reflowing after coating on a substrate by kneading solder powder with flux base, solvent and liquid or pasty flux containing thixo agent and acetylene alcohol based compound. SOLUTION: When a cream solder is prepared by kneading the solder powder and the liquid or pasty flux, further, or 100 pts.wt. of cream solder, about 0.005-1 pts.wt. desirably about 0.01-0.5 pts.wt. of the acetylene alcohol base compound is added and kneaded. This flux contains the flux base and the thixo agent and if necessary, contains an activator. As this acetylene alcohol base compound, 3-methyl-1-bulyn-3-ol,3-methyl-1-pentyne-3-ol,3,5-dimethyl-1-hexyne-3- ol,2,5- dimethyl-3-oxine-2,5-diol, etc., are desirably to be used.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2000</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFBzDnJ19FUI9vdxcQ1ScPRzUXDzCY1QcPMPUkCW4WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYGBkZmxkYWho7GRCkCANxXI4w</recordid><startdate>20000926</startdate><enddate>20000926</enddate><creator>YOKOTA YUJI</creator><creator>ISHIGA FUMIO</creator><creator>YOSHIOKA TAKAYASU</creator><creator>ISHIDA HIDEKI</creator><creator>YOSHITOMI MANABU</creator><creator>ISHIGURO YOSHINOBU</creator><creator>TANAKA TAKASHI</creator><creator>KOJIMA HIROMITSU</creator><creator>SUDO EIICHI</creator><scope>EVB</scope></search><sort><creationdate>20000926</creationdate><title>CREAM SOLDER AND FLUX FOR CREAM SOLDER</title><author>YOKOTA YUJI ; ISHIGA FUMIO ; YOSHIOKA TAKAYASU ; ISHIDA HIDEKI ; YOSHITOMI MANABU ; ISHIGURO YOSHINOBU ; TANAKA TAKASHI ; KOJIMA HIROMITSU ; SUDO EIICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2000263281A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2000</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>YOKOTA YUJI</creatorcontrib><creatorcontrib>ISHIGA FUMIO</creatorcontrib><creatorcontrib>YOSHIOKA TAKAYASU</creatorcontrib><creatorcontrib>ISHIDA HIDEKI</creatorcontrib><creatorcontrib>YOSHITOMI MANABU</creatorcontrib><creatorcontrib>ISHIGURO YOSHINOBU</creatorcontrib><creatorcontrib>TANAKA TAKASHI</creatorcontrib><creatorcontrib>KOJIMA HIROMITSU</creatorcontrib><creatorcontrib>SUDO EIICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YOKOTA YUJI</au><au>ISHIGA FUMIO</au><au>YOSHIOKA TAKAYASU</au><au>ISHIDA HIDEKI</au><au>YOSHITOMI MANABU</au><au>ISHIGURO YOSHINOBU</au><au>TANAKA TAKASHI</au><au>KOJIMA HIROMITSU</au><au>SUDO EIICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CREAM SOLDER AND FLUX FOR CREAM SOLDER</title><date>2000-09-26</date><risdate>2000</risdate><abstract>PROBLEM TO BE SOLVED: To prevent the development of change with the lapse of time during storing or during leaving till reflowing after coating on a substrate by kneading solder powder with flux base, solvent and liquid or pasty flux containing thixo agent and acetylene alcohol based compound. SOLUTION: When a cream solder is prepared by kneading the solder powder and the liquid or pasty flux, further, or 100 pts.wt. of cream solder, about 0.005-1 pts.wt. desirably about 0.01-0.5 pts.wt. of the acetylene alcohol base compound is added and kneaded. This flux contains the flux base and the thixo agent and if necessary, contains an activator. As this acetylene alcohol base compound, 3-methyl-1-bulyn-3-ol,3-methyl-1-pentyne-3-ol,3,5-dimethyl-1-hexyne-3- ol,2,5- dimethyl-3-oxine-2,5-diol, etc., are desirably to be used.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | CREAM SOLDER AND FLUX FOR CREAM SOLDER |
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