CREAM SOLDER AND FLUX FOR CREAM SOLDER

PROBLEM TO BE SOLVED: To prevent the development of change with the lapse of time during storing or during leaving till reflowing after coating on a substrate by kneading solder powder with flux base, solvent and liquid or pasty flux containing thixo agent and acetylene alcohol based compound. SOLUT...

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Bibliographische Detailangaben
Hauptverfasser: YOKOTA YUJI, ISHIGA FUMIO, YOSHIOKA TAKAYASU, ISHIDA HIDEKI, YOSHITOMI MANABU, ISHIGURO YOSHINOBU, TANAKA TAKASHI, KOJIMA HIROMITSU, SUDO EIICHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To prevent the development of change with the lapse of time during storing or during leaving till reflowing after coating on a substrate by kneading solder powder with flux base, solvent and liquid or pasty flux containing thixo agent and acetylene alcohol based compound. SOLUTION: When a cream solder is prepared by kneading the solder powder and the liquid or pasty flux, further, or 100 pts.wt. of cream solder, about 0.005-1 pts.wt. desirably about 0.01-0.5 pts.wt. of the acetylene alcohol base compound is added and kneaded. This flux contains the flux base and the thixo agent and if necessary, contains an activator. As this acetylene alcohol base compound, 3-methyl-1-bulyn-3-ol,3-methyl-1-pentyne-3-ol,3,5-dimethyl-1-hexyne-3- ol,2,5- dimethyl-3-oxine-2,5-diol, etc., are desirably to be used.